KY and EFG Sapphire Method Tube sapphire rods pipe high-pressure

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  • KY and EFG Sapphire Method Tube sapphire rods pipe high-pressure
  • KY and EFG Sapphire Method Tube sapphire rods pipe high-pressure
  • KY and EFG Sapphire Method Tube sapphire rods pipe high-pressure
  • KY and EFG Sapphire Method Tube sapphire rods pipe high-pressure
  • KY and EFG Sapphire Method Tube sapphire rods pipe high-pressure
  • KY and EFG Sapphire Method Tube sapphire rods pipe high-pressure
  • KY and EFG Sapphire Method Tube sapphire rods pipe high-pressure
  • KY and EFG Sapphire Method Tube sapphire rods pipe high-pressure
  • KY and EFG Sapphire Method Tube sapphire rods pipe high-pressure
  • KY and EFG Sapphire Method Tube sapphire rods pipe high-pressure

PRODUCTS DETAILS

Sapphire Rods are used in a wide range of applications. A sapphire rod can be made with all surfaces polished for optical and wear applications or with all surfaces fine grind (un-polished) to serve as an insulator.
Compound Formula Al2O3
Molecular Weight 101.96
Appearance Translucent tubes
Melting Point 2050 °C (3720 °F)
Boiling Point 2,977° C (5,391° F)
Density 4.0 g/cm3
Morphology Trigonal (hex), R3c
Solubility in H2O 98 x 10-6 g/100g
Refractive Index 1.8
Electrical Resistivity 17 10x Ω-m
Poisson's Ratio 0.28
Specific Heat 760 J Kg-1 K-1 (293K)
Tensile Strength 1390 MPa (Ultimate)
Thermal Conductivity 30 W/m-K
Thermal Expansion 5.3 µm/m-K
Young's Modulus 450 GPa
Exact Mass 101.948 g/mol
Monoisotopic Mass 101.94782 Da
During the process of pulling sapphire tubes from a melt with the aid of a seed, the longitudinal temperature gradient in the zone between the solidified front and the region of pulling where the temperature is between 1850 and 1900 deg. C is maintained not in excess of 30 deg. C/cm. The tube so grown is annealed at a temperature between 1950 and 2000 deg. C by increasing the temperature at a rate of 30 to 40 deg. C/min and keeping the tube at said temperature during a period between 3 and 4 hours. After that the tube is cooled down to room temperature at a rate of 30-40 deg. C/min.(HPD CVD, PECVD, Dry Etch, Wet Etch). Plasma applicator tube. Process gas injector nozzles. Endpoint detector. Excimer Corona Tubes.Plasma tube sealing machine is a device used to encapsulate electronic components. Its principle is to use the high temperature and high pressure of plasma to melt the packaging material and encapsulate it on the component. The main components of plasma tube sealing machine include plasma generator, tube sealing chamber, vacuum system, control system, etc.Thermocouple is a commonly used temperature measuring element in temperature measuring instrument, it directly measures the temperature, and converts the temperature signal into thermoelectric electromotive force signal, through the electrical instrument (secondary instrument) into the temperature of the measured medium. Water treatment/cleaning

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